Search
Filters

TH997-288-192-3.0

Part No
TH997-288-192-3.0
Manufacturer
Penchem Technologies Sdn Bhd
Package/Case
-
Datasheet
Download
Description
SOFT SILICONE THERMAL PAD
Stock
14

Shipping Information

Shipped from HK warehouse
Expected Shipping Date Mar 9 to Mar 10 2023
Ship today if order in 3:26:31 (HKT)
Supplier Lead-Time Call for availability
Estimate shipping fee
Enter your destination to get a shipping estimate
Estimate shipping fee
Manufacturer :
Penchem Technologies Sdn Bhd
Product Category :
Thermal - Pads, Sheets
Adhesive :
Tacky - Both Sides
Backing, Carrier :
-
Color :
Blue
Material :
Silicone
Outline :
288.00mm x 192.00mm
Product Status :
Active
Shape :
Rectangular
Thermal Conductivity :
2.4W/m-K
Thermal Resistivity :
-
Type :
Gap Filler Pad, Sheet
Usage :
Thermally Conductive
Datasheets
TH997-288-192-3.0

Manufacturer related products

Catalog related products

footer Upper Image