Third-Generation Semiconductors: Energy Efficiency Revolution, Betting on Data Centers and Automotive
Third-Generation Semiconductors: Energy Efficiency Revolution, Betting on Data Centers and Automotive
Facing the increasingly severe power consumption challenges in AI data centers and electric vehicles, third-generation semiconductor technologies, represented by Silicon Carbide (SiC) and Gallium Nitride (GaN), shone brightly at CES 2026.
Bosch focused on demonstrating AI-driven hardware and software integration solutions covering areas such as mobility, smart home, industrial manufacturing, and semiconductor sensors. Notably, its SiC Trench MOSFETs are a new generation of dual-channel SiC MOSFETs (1200V and 750V) designed to enhance the efficiency, power density, and reliability of electric vehicles.
Texas Instruments (TI) demonstrated GaN power solutions at the exhibition, utilizing 650V bidirectional GaN devices. This enables single-stage topology architectures, significantly improving the power density and energy efficiency of server power supplies. Additionally, TI showcased a humanoid robot servo control solution featuring an integrated GaN FET device, achieving a continuous current output capability of 55A within a package measuring just 4.5 x 5.5mm. This high power density design allows for more compact robot joints, freeing up space for additional functional modules.
Rohm Semiconductor participated in CES 2026 and stated on its website that the company is moving towards a more energy-efficient and interconnected future. From high-performance SiC and GaN power devices for xEVs and energy infrastructure to cutting-edge analog and sensor solutions for industrial and consumer electronics, the company supports next-generation designs requiring high performance and miniaturization.
At the show, STMicroelectronics (ST) showcased the Pagani Utopia hypercar, marking the first time Pagani has collaborated closely and directly with a semiconductor company. ST stated that Pagani met with ST's team in Milan, Italy, and chose to partner with them, partly due to ST's extensive product portfolio. Pagani experienced firsthand ST's leading position in sensors, automotive MCUs, power devices, connectivity, wide bandgap technology, and manufacturing.
